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AB-54008L-175
2 stages RF power amp: PD84001-E + PD54008L-E + LPF N-Channel Enhancement-Mode Lateral MOSFETs
Feature

Excellent thermal stability Frequency: 135 - 175MHz Supply voltage: 7.2V Output power: 5W Current < 1.5A Input power < 10dBm Harmonics level < -70dBc Load mismatch 20:1 VAPC 5V max Beo Free Amplifier RoHS compliant
Mechanical specification: L = 40 mm, W = 20 mm
Description
The AB-54008L-175 is a 2 stages RF power amplifer including output Low Pass Filter for harmonics rejection specifically designed for 2 Ways Comms VHF portable.
Order code
AB-54008L-175
April 2007
Rev 2
1/20
www.st.com 20
Contents
AB-54008L-175
Contents
1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 3 4 5 6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Circuit schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.1 6.2 PowerFLATTM Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.1.1 Mounting indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Thermal Pad and Via design SOT-89 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.2.1 Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
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AB-54008L-175
Electrical data
1
1.1
Electrical data
Maximum ratings
Table 1.
Symbol VDD ID TCASE TA Supply voltage Drain current Operating case temperature Max. ambient temperature
Absolute maximum ratings
Parameter Value 15 2.5 -20 to +85 +55 Unit V A C C
2
Electrical characteristics
TA = +25 oC, VDD = 7.2 V, VAPC Adjusted Table 2.
Symbol FREQ PIN ITOTAL PAE VAPC Harmonics
Electrical specification
Test conditions Frequency range @ POUT = 5W @ POUT = 5W and PIN = 8dBm @ POUT = 5W and PIN = 8dBm @ POUT = 5W and PIN = 8dBm @ POUT = 5W 47% - 52% 4 5 -70 V dBc Min. 135 5 Typ. Max. 175 10 1.5 Unit MHz dBm A
3/20
Typical performance
AB-54008L-175
3
Figure 1.
1.35
Typical performance
Current vs frequency Figure 2.
70 68 66
1.25
Efficiency vs frequency
1.3
64 62 60 58 56
Id (%) 5 dBm
1.15
1.1
Drain Eff. (%)
1.2
54 52 Eff (A) 5 dBm Eff (%) 8 dBm
1.05
Id (A) 8 dBm
1 135 140 145 150 155 160 165 170 175
50 135 140 145 150 155 Freq. (MHz) 160 165 170 175
Figure 3.
33 32
Gain vs frequency
Gain (dB)
31 30 29 28 130 Vdd = 7.2V Pout = 5W V APC adjusted
140
150
160
170
180
Frequency (MHz)
Pin = 8dBm Pin = 5dBm
4/20
AB-54008L-175 Figure 4.
40 38 Vdd = 7.2V Idq = 100m A
Gain (dB)
Typical performance Figure 5.
34 33 32 31 30 29 28 27 26 Vdd = 6V Idq = 300m A
Gain vs input power
Gain vs input power
Gain (dB)
36 34 32 30 28 -4 -2 0 2 4
6
8
10
-4
-2
0
2
4
6
8
10
Input Pow er (dBm ) 135 MHz 155 MHz 175 MHz
Input Pow er (dBm ) 135 MHz 155 MHz 175 MHz
Figure 6.
Gain vs input power
34 33 32 31 30 29 28 27 26 25 24 -4 -2 0
135 MHz
p
Vdd = 5V Idq = 300m A
Gain (dB)
2
4
155 MHz
6
175 MHz
8
10
Input Power (dBm)
Figure 7.
2 1.6 1.2 0.8 0.4 0
Drain current vs output power
Figure 8.
2 Drain current (A) 1.6 1.2 0.8 0.4 0 26 27
Drain current vs output power
p
Drain current (A)
Vdd = 6V Idq = 300m A
Vdd = 5V Idq = 300m A 28 29 30 31 32 33 34 35 36
26 27 28 29 30 31 32 33 34 35 36 37 38 Output Pow er (dBm ) 135 MHz 155 MHz 175 MHz
Output Pow er (dBm ) 135 MHz 155 MHz 175 MHz
5/20
Typical performance Figure 9.
0 -10 -20 -30
AB-54008L-175 S21 response - Low pass filter
S21 (dB)
-40 -50 -60 -70 -80 -90 -100 0 500000000 1000000000 1500000000 2000000000
Frequency (Hz)
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AB-54008L-175 Table 3. Part list
Manufacturer Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Phoenix Contact Coilcraft Coilcraft Coilcraft Coilcraft Coilcraft Coilcraft Coilcraft Coilcraft STMicroelectronics STMicroelectronics Tyco/Electronics Neohm Tyco/Electronics Neohm Tyco/Electronics Neohm Tyco/Electronics Neohm Tyco/Electronics Neohm Size 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 2.54mm , 5 pole 1812 1008 1812 1008 1812 1008 0603 Minispring A QFN 5x5 SOT89 0603 0603 0603 0603 0603 62K 430K 240 150K 11 24nH 39nH 33nH 22nH 35.5nH 27nH 18nH 18.5nH Value nc 1uF 3.3pF 330pF 18pF 12pF 22pF 27pF 15pF 56pF 33pF 100pF 39pF Comment Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor DC connector Inductor Inductor Inductor Inductor Inductor Inductor Inductor Inductor N-Channel Enhancement N-Channel Enhancement Resistor Resistor Resistor Resistor Resistor
Typical performance
Designator C1, C5, C16 C6 C1F C2, C3, C4, C7, C8, C9, C10 C2F C3F C4F, C6F C5F, C12 C7F C11 C13 C14 C15 DC-CON1 L1 L1F L2 L2F L3 L3F L4 L5 PD54008L-E PD84001-E R1, R4 R2 R3 R5 R6
Part Code
GRM1885C1H3R3CZ01 GRM1885C1H391JA01 GRM1885C1H180JA01 GRM1885C1H120JA01 GRM1885C1H220JA01 GRM1885C1H270JA01 GRM1885C1H150JA01 GRM1885C1H560JA01 GRM1885C1H330JA01 GRM1885C1H101JA01 GRM1885C1H390JA01 1725685 1812SMS-33NJ 1008CS-390NX_BW 1812SMS-33NJ 1008CS-220NX_BW 1812SMS-22NJ 1008CS-270NX_BW 0603HC-18NX_BW A05T PD54003L PD84001 CRG Series Thick Film CRG Series Thick Film CRG Series Thick Film CRG Series Thick Film CRG Series Thick Film
7/20
Typical performance Table 3. Part list (continued)
Manufacturer Johnson H = 20mil ; h = 2oz W = 0.92mm ; L = 3mm W = 0.92mm ; L = 7.2mm W = 0.92mm ; L = 6.23mm W = 0.92mm ; L = 6.62mm W = 0.92mm ; L = 5.8mm W = 0.92mm ; L = 2.2mm W = 0.92mm ; L = 11mm W = 0.92mm ; L = 12.4mm W = 0.92mm ; L = 2mm Size Value Comment SMA
AB-54008L-175
Designator RFin, RF OUT Amplifier, RF OUT Filter Substrate TL1 TL2 TL3 TL4 TL5 TL6 TL7 TL8 TL9
Part Code 142-0701-801
Substrate Z = 50 Transmission Line Z = 50 Transmission Line Z = 50 Transmission Line Z = 50 Transmission Line Z = 50 Transmission Line Z = 50 Transmission Line Z = 50 Transmission Line Z = 50 Transmission Line Z = 50 Transmission Line
FR-4
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AB-54008L-175
Circuit layout
4
Circuit layout
Figure 10. Test fixture component layout
Figure 11. test circuit photomaster
9/20
Circuit schematic
AB-54008L-175
5
Circuit schematic
Figure 12. Circuit schematic
Figure 13. Bias schematic
Figure 14. Filter schematic
10/20
AB-54008L-175 Figure 15. Input matching schematic
Circuit schematic
Figure 16. Inter matching schematic
Figure 17. Output matching schematic
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Package mechanical data
AB-54008L-175
6
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
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AB-54008L-175
Package mechanical data
6.1
PowerFLATTM Mechanical data
Table 4.
Dim. Min. A A1 A3 AA b c D d E E2 e f g h 2.49 0.15 0.43 0.64 Typ. 0.90 0.02 0.24 0.25 0.51 0.71 5.00 0.30 5.00 2.57 1.27 3.37 0.74 0.21 2.64 0.098 0.35 0.58 0.79 0.006 0.017 0.025 Max. 1.00 0.05 Min. Typ. 0.035 0.001 0.009 0.01 0.020 0.028 0.197 0.011 0.197 0.101 0.050 0.132 0.03 0.008 0.104 0.014 0.023 0.031 Max. 0.039 0.002
PowerFLATTM Mechanical data
mm inch
Figure 18. PowerFLATTM Package dimensions
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Package mechanical data Table 5.
Dim. Min. Ao Bo Ko 5.15 5.15 1.0 Typ 5.25 5.25 1.1 Max. 5.35 5.35 1.2 Min. 0.12 0.12 0.02 Typ 0.13 0.13 0.02
AB-54008L-175
PowerFLATTM Tape & reel dimensions
mm. inch Max. 0.13 0.13 0.02
Figure 19. PowerFLATTM Tape & reel
14/20
AB-54008L-175
Package mechanical data
6.1.1
Mounting indications
Figure 20. Standard SMD mounting
15/20
Package mechanical data
AB-54008L-175
6.2
Thermal Pad and Via design SOT-89
Thernal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device. The via pattern is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025 plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. Figure 21. Pad layout details
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AB-54008L-175
Package mechanical data
6.2.1
Soldering profile
Figure 22 shows the recommeded solder for devices that have Pb-free terminal plating and where a Pb-free solder is used. Figure 22. Recommended solder profile
Figure 23 shows the recommeded solder for devices with Pb-free terminal plating used with leaded solder, or for devices with leaded terminal plating used with a leaded solder. Figure 23. Recommended solder profile for leaded devices
17/20
Package mechanical data Figure 24. Reel information
AB-54008L-175
18/20
AB-54008L-175
Revision history
7
Revision history
Table 6.
Date 21-Nov-2006 23-Apr-2007
Revision history
Revision 1 2 Initial release. Updated component part list Changes
19/20
AB-54008L-175
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